Sukbae Joo

发表

The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC Substrate

Haedo Jeong, Hyoung Jae Kim, Ho Jun Lee, 2008 .

Tribological Evaluation of Titanium and Aluminum Alloys Exposed to Hydrogen in Wet Conditions

Hong Liang, Sukbae Joo, M. Sanders, 2012 .

The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection

Haedo Jeong, H. Lee, Sukbae Joo, 2009 .

Tribo-electrochemical characterization of copper thin films

Hong Liang, Sukbae Joo, 2013 .

In Situ Characterization of Triboelectrochemical Effects on Topography of Patterned Copper Surfaces

Hong Liang, Sukbae Joo, 2013, Journal of Electronic Materials.

Boron-Based Nanoparticles for Chemical-Mechanical Polishing of Copper Films

Hong Liang, Huaping Xiao, Xingliang He, 2013 .

Mechanical effect of colloidal silica in copper chemical mechanical planarization

Hyunseop Lee, Haedo Jeong, Hyunseop Lee, 2009 .

Effect on Two-Step Polishing Process of Electrochemical Mechanical Planarization and Chemical–Mechanical Planarization on Planarization

Sukhoon Jeong, Hyoungjae Kim, Haedo Jeong, 2009 .

Two-Step Planarization of ECMP and CMP for MEMS Copper Patterns

Haedo Jeong, Ho Jun Lee, Boumyoung Park, 2008 .

Tribo-electrochemical characterization of copper with patterned geometry

Hong Liang, Sukbae Joo, 2012 .

Chemical Mechanical Planarization Method for Thick Copper Films of Micro-Electro-Mechanical Systems and Integrated Circuits

Hyoungjae Kim, Hyunseop Lee, Haedo Jeong, 2008 .