Her-Shu Huang

Influence of convection-dependent adsorption of additives on microvia filling by copper electroplating

Wei-Ping Dow, W. Dow, Ming-Yao Yen, 2005 .

Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition I. Studies Using SEM and Optical Microscope

W. Dow, Her-Shu Huang, 2005 .

Roles of chloride ion in microvia filling by copper electrodeposition -II. Studies using EPR and galvanostatic measurements

Wei-Ping Dow, W. Dow, Ming-Yao Yen, 2005 .

Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling

Wei-Ping Dow, W. Dow, Her-Shu Huang, 2003 .