Mickael Martin

Line edge roughness transfer during plasma etching: modeling approaches and comparison with experimental results

Evangelos Gogolides, Vassilios Constantoudis, Erwine Pargon, 2009, Advanced Lithography.

Is the resist sidewall after development isotropic or anisotropic? effects of resist sidewall morphology on LER reduction and transfer during etching

Evangelos Gogolides, Vassilios Constantoudis, Erwine Pargon, 2010, Advanced Lithography.

A CD AFM study of the plasma impact on 193nm photoresist LWR: role of plasma UV and ions

Olivier Joubert, Erwine Pargon, Mickael Martin, 2009, Advanced Lithography.