Yujeong Shim

发表

Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

Joungho Kim, Jaemin Kim, Jun So Pak, 2010, IEEE Transactions on Advanced Packaging.

High-Throughput, High- Sensitivity Measurement of Power Supply-Induced Bounded, Uncorrelated Jitter in Time, Frequency, and Statistical

Daniel Chow, Yujeong Shim, Shishuang Sun, 2013 .

A Noise Coupling Effect on Reference Voltage Level of Triggering Circuit in Non-coherent UWB Communication System

Changwook Yoon, Jeonghyeon Cho, Joungho Kim, 2009 .

Design of toroidal current probe embedded in multi-layer printed circuit boards for electrostatic discharge(ESD) detection

Joungho Kim, Sunkyu Kong, Eakhwan Song, 2010, 2010 IEEE Electrical Design of Advanced Package & Systems Symposium.

Modeling and Verification to Analyze Effect of Power/Ground Noises on CMOS Feedback Operational Amplifier

Joungho Kim, Jongbae Park, Jongjoo Shim, 2007, 2007 IEEE International Symposium on Electromagnetic Compatibility.

Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package

Jaemin Kim, Joungho Kim, Jongbae Park, 2009, IEEE Transactions on Electromagnetic Compatibility.

An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor

Chulsoon Hwang, Joungho Kim, Jun So Pak, 2011, IEEE Microwave and Wireless Components Letters.

Noise transfer from receiver to transmitter circuits of tranceivers through power supply network(PDN)

Janani Chandrasekhar, Yujeong Shim, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Power integrity analysis for core timing models

Dan Oh, Yujeong Shim, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Passive Equalizer Design Using Defected Ground Structure on PCBs

Joungho Kim, Junwoo Lee, Yujeong Shim, 2010 .

Simultaneous switching noise coupling through via transition for a CMOS negative feedback Operational Amplifier in System-in-Package

Joungho Kim, Bumhee Bae, Jonghyun Cho, 2011, 2011 IEEE 54th International Midwest Symposium on Circuits and Systems (MWSCAS).

Analytical modeling of power distribution network with embedded electromagnetic bandgap structure

Joungho Kim, Chulsoon Hwang, Jaemin Kim, 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.

Improved noise isolation design of UHF mobile radio frequency identification reader system in package

Joungho Kim, Youngwon Kim, Jongbae Park, 2006, 2006 8th Electronics Packaging Technology Conference.

Impact of dynamic power supply noise induced by clock networks on clock jitter and timing margin

Dan Oh, Yujeong Shim, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Supply noise induced jitter modeling and optimization for high-speed interfaces

Guang Chen, Dan Oh, Yujeong Shim, 2015, 2015 IEEE Custom Integrated Circuits Conference (CICC).

A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Chulsoon Hwang, Joungho Kim, Jonghoon Kim, 2012, IEEE Transactions on Electromagnetic Compatibility.

System-level clock jitter modeling for DDR systems

Dan Oh, Mayra Sarmiento, Yujeong Shim, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Analysis of DLL Jitter Affected by Power Supply Noise on Power Distribution Network

Changwook Yoon, Joungho Kim, Jeonghyeon Cho, 2009 .

Wideband Suppression of Radiated Emissions from a Power Bus in High-Speed Printed Circuit Boards

Myunghoi Kim, Yujeong Shim, 2016, J. Inform. and Commun. Convergence Engineering.

Chip-Package-Circuit Co-modeling for Analysis of Digital Power and Ground Noise Coupling Effect on CMOS Negative Feedback Operational Amplifier

Joungho Kim, Jongbae Park, Yujeong Shim, 2007 .

Characterization of On-chip Interconnections and Capacitive Coupling Effect on CMOS Operational Amplifier

Joungho Kim, Andrew Kim, Yujeong Shim, 2009, 2009 20th International Zurich Symposium on Electromagnetic Compatibility.

A jitter equalization technique for minimizing supply noise induced jitter in high speed serial links

Dan Oh, Yujeong Shim, Tim Hoang, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Modeling and Experimental Verification to Investigate the Effect of Power Supply Noise Imbalance on 900MHz Differential LNA

Joungho Kim, Jongjoo Shim, Yujeong Shim, 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.

A Compact and Wide-Band Passive Equalizer Design Using a Stub With Defected Ground Structure for High Speed Data Transmission

Joungho Kim, Woojin Lee, Eakhwan Song, 2010, IEEE Microwave and Wireless Components Letters.

System Level Modeling of Timing Margin Loss Due to Dynamic Supply Noise for High-Speed Clock Forwarding Interface

Dan Oh, Yujeong Shim, 2016, IEEE Transactions on Electromagnetic Compatibility.

Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission

Jiseong Kim, Joungho Kim, Gawon Kim, 2010, IEEE Transactions on Electromagnetic Compatibility.

System level modeling of supply noise induced jitter for high speed clock forwarding interfaces

Dan Oh, Yujeong Shim, 2016, IEEE Electromagnetic Compatibility Magazine.

Experimental verification and analysis for noise isolation of analog and digital chip-package-PCB hierarchical power distribution network

Joungho Kim, Jeongsik Yoo, Jongjoo Shim, 2008, 2008 IEEE 9th VLSI Packaging Workshop of Japan.

Analysis of the Vertical Electromagnetic Bandgap Structures in the Power Distribution Network for the Multi-layer Printed Circuit Board

Joungho Kim, Jongbae Park, Jeongsik Yoo, 2008, 2008 10th Electronics Packaging Technology Conference.

Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package

Jaemin Kim, Joungho Kim, Jeongsik Yoo, 2010, IEEE Transactions on Advanced Packaging.

Power Noise Sensitivity of Micro-Processors with Adaptive Clocking

Yujeong Shim, Yaping Zhou, 2018, 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

Modeling of simultaneous switching noise effects on jitter characteristics of delay locked loop in a hierarchical system of chip-Package-PCB

Joungho Kim, Bumhee Bae, Yujeong Shim, 2011, 2011 8th Workshop on Electromagnetic Compatibility of Integrated Circuits.

Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis

Joungho Kim, Bumhee Bae, Jun So Pak, 2013, IEEE Transactions on Electromagnetic Compatibility.

Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Seungyoung Ahn, Chulsoon Hwang, Joungho Kim, 2013, IEEE Transactions on Electromagnetic Compatibility.

Frequency-Dependent Transmission Line Model of a Stranded Coaxial Cable

Jiseong Kim, Joungho Kim, Gawon Kim, 2010, IEICE Trans. Electron..

A fast and precise eye-diagram estimation method for a channel of a pair of differential microstrip lines on PCB with arbitrary terminations

Joungho Kim, Eakhwan Song, Jeonghyeon Cho, 2009, 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).

Modeling and analysis of power supply noise effects on analog-to-digital converter in 3DIC

Joungho Kim, Bumhee Bae, Jonghyun Cho, 2011, 2011 8th Workshop on Electromagnetic Compatibility of Integrated Circuits.

Hybrid modeling and analysis of power supply noise effects on analog-to-digital converter considering hierarchical PDNs

Joungho Kim, Woojin Ahn, Bumhee Bae, 2010, 2010 IEEE Electrical Design of Advanced Package & Systems Symposium.

Investigation of experimental verification for various Power Distribution Network cases through DLL Clock jitter affected by SSN

Joungho Kim, Jongjoo Shim, Minchul Shin, 2010, 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility.

Characterization and analysis of vertical coupling impact on receiver performance in high speed serial interface

Dan Oh, Janani Chandrasekhar, Yujeong Shim, 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems.

Noise Isolation in LTCC-Based X/Ku-Band Transceiver SiP Using Double-Stacked Electromagnetic Bandgap Structure

Joungho Kim, A.C.W. Lu, Yujeong Shim, 2007, 2007 IEEE International Symposium on Electromagnetic Compatibility.

The scalable modeling of multi-layer embedded capacitor based on LTCC substrate

Joungho Kim, A.C.W. Lu, Yujeong Shim, 2006, 56th Electronic Components and Technology Conference 2006.

Improved PCB via pattern to reduce crosstalk at package BGA region for high speed serial interface

Dan Oh, Yujeong Shim, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Wideband low power distribution network impedance of high chip density package using 3-D stacked through silicon vias

Joungho Kim, Chunghyun Ryu, Jun So Pak, 2008, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility.

A Wideband and Compact Partial Electromagnetic Bandgap Structure With a Narrow Via Pitch for a Signal Via Shield

Joungho Kim, Chulsoon Hwang, Eakhwan Song, 2011, IEEE Transactions on Electromagnetic Compatibility.