Nay Lin

发表

Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging

Jianmin Miao, Nay Lin, Teo Kiat Choon, 2008 .

Through-silicon via fabrication with pulse-reverse electroplating for high density nanoelectronics

J. Miao, Nay Lin, 2013, 2013 IEEE 5th International Nanoelectronics Conference (INEC).

Mechanical and Microstructural Characterization of Through-Silicon Via Fabricated with Constant Current Pulse-Reverse Modulation

J. Miao, P. Dixit, Nay Lin, 2010 .

Synthesis of regular nano-pitched carbon nanotube array by using nanosphere lithography for interconnect applications

J. Miao, F. Chollet, M. Ashraf, 2009 .

Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation

Jianmin Miao, Nay Lin, Pradeep Dixit, 2013, Microelectron. Reliab..

Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating

J. Miao, J. Pang, Luhua Xu, 2007 .

Investigation of Carbon Nanotube Growth on Multimetal Layers for Advanced Interconnect Applications in Microelectronic Devices

J. Miao, Sam Zhang, P. Dixit, 2009 .

Experimental and theoretical study of nanotwinned copper fabricated by pulse-reverse electrodeposition for interconnect and through-silicon via (TSV) technologies

Nay Lin, 2014 .