T. D. Bonifield

Aluminum spiking at contact windows in Al/Ti‐W/Si

L. Melton, T. Bonifield, R. Hawkins, 1988 .

Stress-induced voiding under vias connected to wide Cu metal leads

Joe W. McPherson, M. K. Jain, William R. McKee, 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).

XeF2 photodissociation studies. I. Quantum yields and kinetics of XeF(B) and XeF(C)

R. A. Gutcheck, G. K. Walters, T. Bonifield, 1981 .