Y.Y. Wang

Board level drop test reliability of IC packages

E.H. Wong, J. Chia, Y.M. Tan, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Finite element modeling of CSP package subjected to board level drop test

T. Chai, Y. Wang, T.C. Chai, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).