G. Verbinnen

Integration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications

E. Beyne, A. Jourdain, A. La Manna, 2012, 2012 4th Electronic System-Integration Technology Conference.

Temporary wafer bonding defect impact assessment on substrate thinning: Process enhancement through systematic defect track down

E. Beyne, A. Jourdain, S. Suhard, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability

B. Parvais, A. Vandooren, G. Hellings, 2018, 2018 IEEE Symposium on VLSI Technology.

Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging

E. Beyne, P. Jaenen, A. Phommahaxay, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.