Xiaosong Ma

发表

Xianping Chen, Luqi Tao, Jing Qian, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Xiaosong Ma, Yongfa Cheng, B. Xu, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Xiaosong Ma, Zebang Huang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

K. Jansen, G.Q. Zhang, L. Ernst, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Xiaosong Ma, Zhengqi Zhong, Changhua Tang, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Xiaosong Ma, 2014, 2014 15th International Conference on Electronic Packaging Technology.

O. van der Sluis, W. V. van Driel, G. Zhang, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Xiaosong Ma, Zebang Huang, Junchao Wang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Lei Liu, Xiaosong Ma, Kailin Pan, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Xianping Chen, Chun-Jian Tan, Qun Yang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

K. Jansen, L. Ernst, Xiaosong Ma, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Xiaosong Ma, Yongfa Cheng, Feiyang Liu, 2018, Proceedings of the 1st International Conference on Numerical Modelling in Engineering.

Xiaosong Ma, Yongfa Cheng, Feiyang Liu, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

O. van der Sluis, W. V. van Driel, K. Jansen, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Xiaosong Ma, Hélène Frémont, Kaspar M. B. Jansen, 2009, Microelectron. Reliab..

G. Zhang, Xiaosong Ma, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Xiaosong Ma, Hélène Frémont, Willem D. van Driel, 2010, Microelectron. Reliab..

Xiaosong Ma, Li Li, Xi Zhou, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

G. Zhang, Xiaosong Ma, Xianmin Huang, 2013, 2013 14th International Conference on Electronic Packaging Technology.

O. van der Sluis, W. V. van Driel, G. Zhang, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Xiaosong Ma, Yongfa Cheng, Feiyang Liu, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).