Hyungdong Lee

TSV mutual inductance effect on impedance of 3D stacked on-chip PDN with Multi-TSV connections

Joungho Kim, Jun So Pak, Jonghyun Cho, 2010, 2010 IEEE CPMT Symposium Japan.

Nonlinear effects of TSV and harmonic generation

Joungho Kim, Jun So Pak, Jonghyun Cho, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Thermal effects on through-silicon via (TSV) signal integrity

Joungho Kim, Manho Lee, Jun So Pak, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Temperature-dependent through-silicon via (TSV) model and noise coupling

Joungho Kim, Manho Lee, Jun So Pak, 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.

Through silicon via (TSV) equalizer

Joungho Kim, Eakhwan Song, Jeonghyeon Cho, 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.

Through silicon via (TSV) shielding structures

Joungho Kim, Jun So Pak, Taigon Song, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

Through-silicon via (TSV) depletion effect

Joungho Kim, Jun So Pak, Jonghyun Cho, 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.

Active circuit to through silicon via (TSV) noise coupling

Joungho Kim, Jun So Pak, Eakhwan Song, 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.

Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

Joungho Kim, Jun So Pak, Jonghyun Cho, 2010, 2010 IEEE CPMT Symposium Japan.

On-chip PDN design effects on 3D stacked on-chip PDN impedance based on TSV interconnection

Joungho Kim, Jun So Pak, Jonghyun Cho, 2010, 2010 IEEE Electrical Design of Advanced Package & Systems Symposium.

Guard ring effect for through silicon via (TSV) noise coupling reduction

Joungho Kim, Jun So Pak, Jonghyun Cho, 2010, 2010 IEEE CPMT Symposium Japan.