C. F. Tsang

Adhesion Studies of Ta ∕ Low-k (Black Diamond) Interface using Thermocompressive Wafer Bonding and Four-Point Bend

Chee Lip Gan, Narayanan Balasubramanian, Dim-Lee Kwong, 2006 .

Comparative studies of physical and chemical properties of plasma-treated CVD low k SiOCH dielectrics

Vladimir Bliznetsov, C. F. Tsang, Y. J. Su, 2004 .

130 nm process technology integration of advanced Cu/CVD low k dielectric material-case study of failure analysis and yield enhancement

C. F. Tsang, Y. J. Su, V. N. Bliznetsov, 2003, Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003.

An investigation on the plasma treatment of integrated circuit bond pads

C. F. Tsang, Y. F. Chong, R Gopalakrishnan, 2000 .

Impact of barrier metal on electrical performance of Cu/low K (Black Diamond™) in 0.13μm dual damascene interconnection

C. Y. Li, Hongyu Li, C. F. Tsang, 2004 .