Steve Wang
发表
Jeff Gelb,
Wenbing Yun,
S. H. Lau,
2009,
2009 IEEE International Interconnect Technology Conference.
Hongtao Cui,
Michael Feser,
Fred Duewer,
2007
.
A Transmission X-ray Microscope (TXM) for Non-destructive 3D Imaging of ICs at Sub-100 nm Resolution
Alan Lyon,
Wenbing Yun,
Markus Kuhn,
2003
.