A. Mueller

Demonstration of a novel hybrid silicon-resin high density interconnect (HDI) substrate

B. Smith, P. Kwok, J. Thompson, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

A Thermal Imaging System for Crack Growth Quantification in Thermo-Mechanical Fatigue Specimens

A. Mueller, G. White, G. Torrington, 1996 .