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Redistribution Layers (RDLs) for 2.5D/3D IC Integration

John H. Lau, P. Tzeng, M. Kao, 2013 .

Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12" (300mm) wafer for 3D IC Integration

J. H. Lau, M. Brillhart, Li Li, 2011 .