R. Gouk

Acoustic reflection coefficient of silicon wafers in megasonic cleaning tanks

D. Kittelson, T. Kuehn, Ming Zang, 1997, 1997 IEEE Ultrasonics Symposium Proceedings. An International Symposium (Cat. No.97CH36118).

Particle removal from semiconductor wafers by megasonic cleaning

Thomas H. Kuehn, David B. Kittelson, D. Kittelson, 1996 .

Optimizing Ultrasonic Cleaning for Disk Drive Components

R. Gouk, 1997 .

Contactless bottom-up electrodeposition of nickel for 3D integrated circuits

S. Verhaverbeke, F. Shadman, Mingrui Zhao, 2015 .

Facile synthesis of bimetallic Ag/Ni core/sheath nanowires and their magnetic and electrical properties.

Younan Xia, A. Briseno, Jie Zeng, 2010, Small.

Application of Process Simulation for Comparison of Contactless and Conventional Electrodeposition Methods for 3D Packaging

Farhang Shadman, Mingrui Zhao, Kyle Jakes, 2016 .

Investigations of solution variables in a contactless copper electrodeposition process for 3D packaging applications

S. Verhaverbeke, F. Shadman, Mingrui Zhao, 2015 .

Facile synthesis of bimetallic Ag/Ni core/sheath nanowires and their magnetic and electrical properties.

Younan Xia, A. Briseno, Jie Zeng, 2010, Small.