M. Itoh

Passive alignment packaging on Si optical bench using AuSn solder bumps

Junichi Sasaki, A. Uda, M. Itoh, 1997, Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting.

Hybrid 4×4 optical matrix switch module on silica based Planar Lightwave Circuit by self-align multiple chip bonding technique

Junichi Sasaki, Hiroshi Hatakeyama, Mitsuhiro Kitamura, 1998 .

Hybrid integrated symmetric Mach-Zehnder all-optical switch with ultrafast, high extinction switching

Junichi Sasaki, Shigeru Nakamura, Hiroshi Hatakeyama, 1999 .

Self-aligned assembly technology for laser diode modules using stripe-type AuSn solder bump flip-chip bonding

Junichi Sasaki, Toshitaka Torikai, A. Uda, 1995, LEOS '95. IEEE Lasers and Electro-Optics Society 1995 Annual Meeting. 8th Annual Meeting. Conference Proceedings.

168 Gbps error-free demultiplexing with hybrid-integrated symmetric Mach-Zehnder all-optical switch

Junichi Sasaki, Hiroshi Hatakeyama, Tomoaki Kato, 2000, Optical Fiber Communication Conference. Technical Digest Postconference Edition. Trends in Optics and Photonics Vol.37 (IEEE Cat. No. 00CH37079).

Use of AuSn solder bumps in three-dimensional passive aligned packaging of LD/PD arrays on Si optical benches

Isao Yoneda, Junichi Sasaki, K. Fukushima, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Hybrid integrated 4/spl times/4 optical matrix switch using self-aligned semiconductor optical amplifier gate arrays and silica planar lightwave circuit

Junichi Sasaki, Hiroshi Hatakeyama, M. Yamaguchi, 1998 .