Tan Ai Min

Influence of bump geometry, adhesives and pad finishings on the joint resistance of Au bump and A/NCA flip chip interconnection

A. Yeo, C. Lee, Tan Ai Min, 2005, 2005 7th Electronic Packaging Technology Conference.

Application of finite element analysis on flip chip ball grid array package with 65nm Cu/low-κ device

A. Yeo, C. Lee, C. Lee, 2006, 2006 8th Electronics Packaging Technology Conference.

Flip Chip Interconnection Systems and its Reliability Performance

A. Yeo, C. Lee, C. Lee, 2006, 2006 1st Electronic Systemintegration Technology Conference.

No-clean polymer flux evaluations and its impact on BGA solder joint quality and board level reliability

Tan Ai Min, Lee Choon Mei Serene, Carlo Marbella, 2010, 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).