Z. C. Lu

Ta and Ta–N diffusion barriers sputtered with various N2/Ar ratios for Cu metallization

J. H. Wang, W. Y. Hsieh, J. H. Wang, 2002 .

Measurement of electron energy distribution function in an argon/copper plasma for ionized physical vapor deposition

J. Foster, A. Wendt, J. Booske, 1999 .

Interactions between plasmas in ionized physical vapor deposition discharges

A. Wendt, Z. C. Lu, T. G. Snodgrass, 2000 .