C. W. Tan
发表
Cecil Armstrong,
Gary Menary,
Eileen Harkin-Jones,
2010
.
Y. C. Chan,
N. H. Yeung,
C. W. Tan,
2003
.
Mohd Ambar Yarmo,
A. R. Daud,
M. Yarmo,
2002
.
Y. C. Chan,
Y. Chan,
C. W. Tan,
2008
.
C. T. Tam,
Y. H. Loo,
C. Tam,
1989
.
A. R. Daud,
C. W. Tan,
2002
.
K. Pey,
H. Zheng,
X. Wang,
2010,
Optics express.
Y. Chan,
A. So,
C. W. Tan,
2005
.
Y. Chan,
C. W. Tan,
Y. Chiu,
2003
.
K. Y. Lau,
A. Vaughan,
K. Y. Ching,
2021,
IEEE Transactions on Dielectrics and Electrical Insulation.
K. Y. Lau,
A. Vaughan,
K. Y. Ching,
2020,
2020 IEEE 3rd International Conference on Dielectrics (ICD).
K. Y. Lau,
A. Vaughan,
N. Muhamad,
2019,
IEEE Transactions on Dielectrics and Electrical Insulation.
Interfacial microstructure and fracture behavior of laser welded–brazed Mg alloys to Zn-coated steel
Weisi Guo,
C. Mei,
C. W. Tan,
2013,
The International Journal of Advanced Manufacturing Technology.
B. Tay,
E. Teo,
W. Chow,
2012,
Advanced materials.
Yan-bin Chen,
Liqun Li,
C. Tan,
2013
.
C. W. Tan,
C. Adam,
L. Hogan,
1981
.
C. Armstrong,
Peter J. Martin,
G. Menary,
2012
.
C. G. Armstrong,
K. Tshai,
G. Menary,
2005
.
Y. C. Chan,
C. W. Tan,
H. P. Chan,
2004,
Microelectron. Reliab..
N. H. Yeung,
Y. Chan,
C. W. Tan,
2006
.
Interfacial microstructure and fracture behavior of laser welded–brazed Mg alloys to Zn-coated steel
W. Guo,
Lin Li,
Weisi Guo,
2013
.
K. Y. Lau,
K. Y. Ching,
C. W. Tan,
2023,
2023 IEEE 3rd International Conference in Power Engineering Applications (ICPEA).
K. Y. Lau,
Z. Abdul-Malek,
K. Y. Ching,
2020,
2020 IEEE International Conference on Power and Energy (PECon).
K. Pey,
H. Zheng,
X. Wang,
2010
.
G. Lim,
L. M. Wee,
L. E. Khoong,
2011
.
K. Y. Lau,
C. W. Tan,
2020,
Environment, Development and Sustainability.
C. W. Tan,
N. H. Yeung,
Y. C. Chan,
2004
.
Pooi See Lee,
K. Pey,
C. W. Tan,
2006
.
Y. C. Chan,
C. W. Tan,
N. H. Yeung,
2003,
Microelectron. Reliab..
Z. Nie,
C. W. Tan,
B. He,
2023,
Materials Science & Engineering: A.
K. Y. Lau,
Mona Riza Mohd Esa,
R. Ayop,
2023,
2023 IEEE 3rd International Conference in Power Engineering Applications (ICPEA).
C. Armstrong,
N. Billon,
G. Menary,
2006
.