C. Q. Chen

发表

An associatively classified partitioned vector quantizer

Soo Ngee Koh, Ing Yann Soon, C. Q. Chen, 1999, Signal Process..

In-depth circuits edit analysis to reveal the implantation-related defect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. J..

Electrical simulation on the localized NVM failed cell by AFP nanoproing

C. Q. Chen, G. B. Ang, Z. H. Mai, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern

C. Q. Chen, Francis Rivai, G. B. Ang, 2017, Microelectron. Reliab..

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system

L. Zhu, Ran He, Hao Tan, 2016, Microelectron. Reliab..

Sample Preparation in Recover Physical Defects on MIM Related failure for Different Devices In Wafer Fabrication

C. Q. Chen, D. Nagalingam, F. Rivai, 2019, 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).

The influence of AlN buffer layer thickness grown by pulsed atomic layer epitaxy on the properties of GaN epilayer

Jin Zhang, C. Q. Chen, H. Xiong, 2011, Other Conferences.

Electrical analysis on implantation-related defect by nanoprobing methodology

Jeffrey Lam, C. Q. Chen, Francis Rivai, 2016, Microelectron. Reliab..

Failure analysis based on dummy TIVA spot

C. Q. Chen, G. B. Ang, H. P. Ng, 2013, Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

The effects of growth temperature of the pulse atomic layer epitaxy AlN films grown on sapphire by MOCVD

C. Q. Chen, Y.-Y. Fang, H. Xiong, 2011, Other Conferences.

Patterning Curved Three-Dimensional Structures With Programmable Kirigami Designs

Fei Wang, Yihui Zhang, C. Q. Chen, 2017 .

Nanoprobing on the SRAM static noise margin (SNM) soft fail analysis

C. Q. Chen, Francis Rivai, Z. H. Mai, 2016, 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis

C. Q. Chen, Francis Rivai, G. B. Ang, 2017, Microelectron. Reliab..

Static fault localization on Memory failures using Photon Emission Microscopy

C. Q. Chen, J. Lam, G. B. Ang, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. Reliab..

Fault isolation on the wafer with lithography hotspot signature

C. Q. Chen, J. Lam, Francis Rivai, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Cross-sectional nanoprobing fault isolation technique on submicron devices

L. Zhu, Ran He, Y. Z. Zhao, 2016, Microelectron. Reliab..

Polarization effects in photoluminescence of C- and M-plane GaN/AlGaN multiple quantum wells

Grigory Simin, Bruce H. T. Chai, C. Q. Chen, 2002 .