Ying-Jiunn Lai

2.4 GHz Bluetooth module with integral passives in multi-dielectric layer printed-circuit boards

Uei-Ming Jow, Chun-Kun Wu, Chang-Sheng Chen, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Embedded passives technology for Bluetooth application in multi-layer printed wiring board (PWB)

Uei-Ming Jow, Chun-Kun Wu, Chang-Sheng Chen, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Embedded capacitors technology in 2.4 GHz power amplifier with multi-layer printed wiring board (PWB) process

Uei-Ming Jow, Chun-Kun Wu, Shur-Fen Liu, 2002, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002..

Functional embedded RF circuits on multi-layer printed wiring board (PWB) process

Uei-Ming Jow, Chin-Sun Shyu, Uei-Ming Jow, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Embedded passives on multi-layer printed wiring board (PWB) for 5GHz front-end module

Uei-Ming Jow, Chin-Sun Shyu, Uei-Ming Jow, 2006, 56th Electronic Components and Technology Conference 2006.