Daniel Moses Fernandez

Process and reliability assessment of 200μm-thin embedded wafer level packages (EMWLPs)

Srinivasa Rao Vempati, Chee Houe Khong, Ser Choong Chong, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications

Vempati Srinivasa Rao, Chen Zhaohui, Ser Choong Chong, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).