S. Nangalia

发表

Characterization study of flip chip integration for MEMS

Vijayakumar R. Dhuler, Karen W. Markus, Allen Cowen, 1996, Smart Structures.

Smart MEMS: flip chip integration of MEMS and electronics

Vijayakumar R. Dhuler, Karen W. Markus, Allen Cowen, 1995, Smart Structures.

Flip chip process development techniques using a modified laboratory aligner bonder

S. Nangalia, M. Schneider, V. Saba, 1995, Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'.

Issues with fine pitch bumping and assembly

A. Huffman, S. Nangalia, P. A. Deane, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).