Young-Min Kim

Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

Young-Ho Kim, Sungtae Kim, Sungtae Kim, 2010 .

A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging

Kyoung-Moo Harr, Sung Yi, Young-Ho Kim, 2009, 2009 59th Electronic Components and Technology Conference.

Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn−4.0Ag−0.5Cu and Cu−Zn Substrate

Young-Ho Kim, Young-Ho Kim, Young-Min Kim, 2010 .

The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn–3.5Ag solders on Cu substrates in fluxless soldering

Sung Woo Ma, Young-Ho Kim, Nam-Seog Kim, 2013, Journal of Materials Science: Materials in Electronics.

Interfacial reactions between Sn–3.0Ag–0.5Cu solder and Cu–xZn (x = 0–35 wt%) or Cu–xZn–yNi (x = 20 and 25 wt%, y = 15 and 10 wt%) substrates

Min Young Choi, Young-Ho Kim, Young-Ho Kim, 2013 .