Hee-Ra Roh

Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

Young-Ho Kim, Sungtae Kim, Sungtae Kim, 2010 .

Contact resistance and shear strength of the solder joints formed using Cu bumps capped with Sn or Ag/Sn layer

Young-Ho Kim, Seunghyun Lee, Young-Ho Kim, 2005 .