Fabrice Duval

A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

Eric Beyne, Andy Miller, John Slabbekoorn, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Packaging Material Evaluation for 2.5D/3D TSV Application

Eric Beyne, Mikael Detalle, Andy Miller, 2016 .