E. Dentoni Litta

Structure of the interface in sub-nm EOT TmSiO/HfO2 gate stack

Steve Hall, Mikael Östling, Ivona Z. Mitrovic, 2016 .

Buried power SRAM DTCO and system-level benchmarking in N3

J. Ryckaert, P. Weckx, A. Spessot, 2020, 2020 IEEE Symposium on VLSI Technology.

First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers

J. Ryckaert, T. Chiarella, N. Horiguchi, 2020, 2020 IEEE Symposium on VLSI Technology.

Three-Dimensional Integration of Ge and Two-Dimensional Materials for One-Dimensional Devices

Mikael Östling, E. Dentoni Litta, Per-Erik Hellström, 2016 .

Novel forksheet device architecture as ultimate logic scaling device towards 2nm

J. Ryckaert, D. Verkest, P. Weckx, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

Rare-earth oxide interfacial layer for sub-nm EOT CMOS technology

Steve Hall, Mikael Östling, Ivona Z. Mitrovic, 2016 .

Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper

A. Vandooren, Naoto Horiguchi, Dimitri Linten, 2021, 2021 International Conference on IC Design and Technology (ICICDT).