Michael S. Hibbs

发表

Through-pitch correction of scattering effects in 193-nm alternating phase-shift masks

Ronald L. Gordon, Martin Burkhardt, Michael S. Hibbs, 2002, SPIE Advanced Lithography.

Evaluation of molybdenum silicide for use as a 193-nm phase-shifting absorber in photomask manufacturing

Anatoly Bourov, Hideaki Mitsui, Masao Ushida, 2001, SPIE Photomask Technology.

Characterizing photomask etch processes by phase component analysis (PCA)

Richard Wistrom, Toru Komizo, Michael S. Hibbs, 2007, SPIE Photomask Technology.

Optimum mask and source patterns to print a given shape

Kafai Lai, Scott J. Bukofsky, Alfred K. K. Wong, 2001, SPIE Advanced Lithography.

Evaluation of 32nm advanced immersion lithography pellicles

Kenneth C. Racette, Monica Barrett, Robert Nolan, 2008, Photomask Technology.

Scaling rules of phase error control for the manufacturing of alternating phase-shifting masks for 193-nm photolithography and beyond

Scott J. Bukofsky, Scott Halle, Qiang Wu, 2003, SPIE Advanced Lithography.

Characterization of binary and attenuated phase shift mask blanks for 32nm mask fabrication

Richard Wistrom, Yasutaka Kikuchi, Emily Gallagher, 2008, Photomask Technology.

Imaging behavior of high-transmission attenuating phase-shift mask films

Toru Komizo, Satoru Nemoto, Michael S. Hibbs, 2006, SPIE Photomask Technology.

The effect of mask substrate and mask process steps on patterned photomask flatness

Kenneth C. Racette, Monica Barrett, Michael S. Hibbs, 2005, SPIE Advanced Lithography.

Use Of Carbonized Photoresist For Optical Mask Repair

Burn Jeng Lin, Michael S. Hibbs, Yuli Vladimirsky, 1988, Advanced Lithography.

All-dry resist processes for 193-nm lithography

Roderick R. Kunz, S. C. Palmateer, Michael S. Hibbs, 1995, Advanced Lithography.

Direct interferometric phase measurement using an aerial image measurement system

Song Peng, Michael S. Hibbs, 1999, Advanced Lithography.

DUV printability of laser repairs on binary and attenuated phase-shift masks

James A. Reynolds, Michael S. Hibbs, Dennis M. Hayden, 1996, Photomask and Next Generation Lithography Mask Technology.

Your worst nightmare: inspection of aggressive OPC on 14nm masks with emphasis on defect sensitivity and wafer defect print predictability

Kazunori Seki, Ian Stobert, Dan J. Dechene, 2013, Photomask Technology.

Optimum mask and source patterns to print a given shape

Alan E. Rosenbluth, Rama N. Singh, Kafai Lai, 2002 .

Evaluating films for high transmission attenuated phase shift masks

Yasutaka Kikuchi, Emily Gallagher, Toru Komizo, 2006, Photomask Japan.

Deep-UV diagnostics using continuous tone photoresist

Michael S. Hibbs, Joseph P. Kirk, 1991, Other Conferences.

Quantitative stepper metrology using the focus monitor test mask

Christopher P. Ausschnitt, Timothy A. Brunner, Ronald M. Martino, 1994, Advanced Lithography.

Wavelength dependent mask defects

Andrew J. Watts, Tom Faure, Karen D. Badger, 2005, SPIE Advanced Lithography.

Deep-UV photolithography linewidth variation from reflective substrates

Michael S. Hibbs, James A. Bruce, Diana D. Dunn, 1991, Other Conferences.

Novel Si-based composite thin films for 193/157-nm attenuated phase-shift mask (APSM) applications

Kenneth C. Racette, Marie Angelopoulos, Kurt R. Kimmel, 2001, SPIE Advanced Lithography.

Evalution of 193-nm alternating-aperture phase-shift mask dry etch processes

Timothy A. Brunner, Jason Plumhoff, Chris Constantine, 2003, Photomask Japan.

Evaluation of the accuracy of complex illuminator designs

Shinpei Kondo, Kazunori Seki, Gregory McIntyre, 2011, Photomask Technology.

Phase calibration for attenuating phase-shift masks

Timothy A. Brunner, Michael S. Hibbs, 2006, SPIE Advanced Lithography.

Lithographic qualification of new opaque MoSi binary mask blank for the 32-nm node and beyond

Scott Halle, Yasutaka Kikuchi, Ryan Deschner, 2010 .