P. Arunasalam

Determination of thermal compact model via evolutionary genetic optimization method

K. N. Seetharamu, P. Arunasalam, K.N. Seetharamu, 2005, IEEE Transactions on Components and Packaging Technologies.

Z-axis interconnects using fine pitch, nanoscale through-silicon vias: Process development

P. Arunasalam, S. Spiesshoefer, S. Burkett, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Thermo-Mechanical Analysis of Thru-Silicon-Via Based High Density Compliant Interconnect

P. Arunasalam, B.G. Sammakia, Fan Zhou, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Modeling Heat Transport in Thermal Interface Materials Enhanced With MEMS-Based Microinterconnects

B. Sammakia, P. Arunasalam, B.T. Murray, 2010, IEEE Transactions on Components and Packaging Technologies.