R. Doering
发表
B. Michel,
R. Dudek,
H. Hedler,
2005,
2005 7th Electronic Packaging Technology Conference.
B. Michel,
R. Dudek,
B. Michel,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.