Yung-Sheng Lin

发表

Photocurrent Suppression of Transparent Organic Thin Film Transistors

H. Shieh, Fang‐Chung Chen, C. Chuang, 2007 .

Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density

Kwang-Lung Lin, C. Kao, Chien-Lung Liang, 2020 .

Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines

Kwang-Lung Lin, C. Kao, Chien-Lung Liang, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Thermophysical characteristics of Ethylene Glycol-based Copper nanofluids Using Nonequilibrium and Equilibrium Methods

P. Hsiao, C. Chieng, Yung-Sheng Lin, 2012 .

A mechanism of thrust enhancement on a heaving plate due to flexibility at moderately low Reynolds numbers

Chien-Cheng Chang, C. Hsieh, C. Chu, 2017 .

Constructing a force interaction model for thermal conductivity computation using molecular dynamics simulation: ethylene glycol as an example.

P. Hsiao, C. Chieng, Yung-Sheng Lin, 2011, The Journal of chemical physics.

Low-voltage organic thin-film transistors with polymeric nanocomposite dielectrics

Han-Ping D. Shieh, Fang-Chung Chen, H. Shieh, 2006 .

Surface passivation of c-Si by Atomic Layer Deposition TiO2 thin films deposited at low temperature

Ing-Song Yu, I. Yu, Hsyi-En Cheng, 2014, 2014 IEEE 40th Photovoltaic Specialist Conference (PVSC).

Copper phthalocyanine buffer layer to enhance the charge injection in organic thin-film transistors

Fang-Chung Chen, Fang‐Chung Chen, Yung-Sheng Lin, 2007 .

Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu

T. Lin, Kwang-Lung Lin, C. Kao, 2021 .

Adaptive fuzzy-based rate management and power control in multimedia CDMA cellular systems

Young-Long Chen, Jyh-Horng Wen, Jyu-Wei Wang, 2008, Comput. Commun..

Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection

C. Kao, C. Kao, Yung-Sheng Lin, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration

C. Kao, C. Kao, Yung-Sheng Lin, 2022, Materials.

Efficient Hole-Injection in Highly Transparent Organic Thin-Film Transistors

Fang-Chung Chen, Fang‐Chung Chen, Yung-Sheng Lin, 2007 .

Roles of nanolayer and particle size on thermophysical characteristics of ethylene glycol-based copper nanofluids

P. Hsiao, C. Chieng, Yung-Sheng Lin, 2011 .

Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging

Kwang-Lung Lin, C. Kao, Chien-Lung Liang, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Fine-Pitch $30\ \mu \mathrm{m}$ Cu-Cu Bonding using Electroless Nano-Ag

C. Kao, Yung-Sheng Lin, Y. Hung, 2023, Electronic Components and Technology Conference.