D.A. Gajewski

Electromigration of Cu-Sn-Cu micropads in 3D interconnect

Zhihong Huang, S. Pozder, R. Chatterjee, 2008, 2008 58th Electronic Components and Technology Conference.

Electromigration performance enhancement of Cu interconnects with PVD Ta cap

M. Lien, J. Walls, B. Feil, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.