Kwang-Seong Choi

发表

Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology

Kwang-Seong Choi, Jiho Joo, Ki-seok Jang, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

System-on-Packaging with Electroabsorption Modulator for a 60-GHz Band Radio-Over-Fiber Link

Hyun-Kyu Yu, Kwang-Seong Choi, Yong-Duck Chung, 2008, IEEE Transactions on Advanced Packaging.

Modeling and analysis of high-speed through silicon via (TSV) channel and defects

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Novel Bumping Material for Solder-on-Pad Technology

Kwang-Seong Choi, Yong-Sung Eom, Jong-Tae Moon, 2011 .

Right-Angle-Bent CPW for the Application of the Driver-Amplifier-Integrated 40 Gbps TW-EML Module

Kwang-Seong Choi, Ho-Gyeong Yun, Jong-Tae Moon, 2006 .

System-On-Packaging Transmitter for 60-GHz Electric-to-Optical Signal Conversion

Hyun-Kyu Yu, Kwang-Seong Choi, Yong-Duck Chung, 2008, 2008 Global Symposium on Millimeter Waves.

Small-area and high-inductance semi-stacked spiral inductor with high Q factor

Kwang-Seong Choi, Hyo-Hoon Park, Tae-Woo Lee, 2012 .

Fault detection and isolation of multiple defects in through silicon via (TSV) channel

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Novel Maskless Bumping for 3D Integration

Kwang-Seong Choi, Yong-Sung Eom, Jong-Tae Moon, 2010 .

Fine‐Pitch Solder on Pad Process for Microbump Interconnection

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2013 .

Effects of packaging design on the performance of TWEAM module for digital and analog applications

Kwang-Seong Choi, Yong-Duck Chung, Jong-Tae Moon, 2004, The 17th Annual Meeting of the IEEELasers and Electro-Optics Society, 2004. LEOS 2004..

Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis

Kwang-Seong Choi, Yong-Sung Eom, Jong-Tae Moon, 2017, Microelectron. Reliab..

ANALOG CHARACTERISTICS OF ELECTROABSORPTION MODULATOR FOR RF/OPTIC CONVERSION; RF GAIN AND IMD3

Kwang-Seong Choi, Sung-Bock Kim, Yong-Duck Chung, 2006 .

Modeling and analysis of open defect in through silicon via (TSV) channel

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2013, 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive

Kwang-Seong Choi, Yong-Sung Eom, Jong-Hyun Lee, 2011 .

Characteristics of 60 GHz Analog RF-Optic Transceiver Module

Kwang-Seong Choi, Yong-Duck Chung, Jeha Kim, 2007, IEICE Trans. Electron..

Channel estimation and synchronization for polarization-division multiplexed CO-OFDM using subcarrier/polarization interleaved training symbols.

Kwang-Seong Choi, Eun Soo Nam, Xiang Liu, 2011, Optics express.

Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2013 .

40 Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Lasers Fabricated Using Selective Area Growth

Kwang-Seong Choi, Ho-Gyeong Yun, Sung-Bock Kim, 2009 .

60 GHz band RF/RoF Link characteristics of enhanced optical transmitter SoP module

Hyun-Kyu Yu, Kwang-Seong Choi, Yong-Duck Chung, 2007, 2007 European Microwave Conference.

Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules

Kwang-Seong Choi, Ho-Gyeong Yun, Jong-Tae Moon, 2008 .

3D SiP module using TSV and novel low-volume solder-on-pad(SoP) process

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2012, 2012 4th Electronic System-Integration Technology Conference.

Impedance Matching Approach to 60 GHz Band Analog Traveling Wave Electro-Absorption Modulator (TWEAM) Module

Kwang-Seong Choi, Yong-Duck Chung, Dong-Suk Jun, 2005, 2005 International Topical Meeting on Microwave Photonics.

Improving the Noise Figure of the 60-GHz Radio-over-Fiber System using a System-on-Package EAM Module with Two-Stage LNAs

Kwang-Seong Choi, Yong-Duck Chung, Dong-Soo Shin, 2007, Microwave Photonics, 2007 Interntional Topical Meeting on.

Hybrid-integrated coherent receiver using silica-based planar lightwave circuit technology

Kwang-Seong Choi, Eun-Soo Nam, Joong-Seon Choe, 2011, 2011 Asia Communications and Photonics Conference and Exhibition (ACP).

Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration

Kwang-Seong Choi, Jiho Joo, Yong-Sung Eom, 2019, 2019 International 3D Systems Integration Conference (3DIC).

Fault isolation of short defect in through silicon via (TSV) based 3D-IC

Kwang-Seong Choi, Hongseok Kim, Heegon Kim, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Hybrid-integrated coherent receiver using chip-to-chip bonding technology

Kwang-Seong Choi, Eun-Soo Nam, Yong-Hwan Kwon, 2012, 2012 Asia Communications and Photonics Conference (ACP).

High inductance LTCC based spiral inductor with small area and high quality factor

Kwang-Seong Choi, Hyo-Hoon Park, Tae-Woo Lee, 2011, 13th International Conference on Advanced Communication Technology (ICACT2011).

Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity

Joungho Kim, Seungwook Paek, Lee-Sup Kim, 2013 .

Optimization of Packaging Design of TWEAM Module for Digital and Analog Applications

Kwang-Seong Choi, Yong-Duck Chung, Jeha Kim, 2004 .

HV-SoP Technology for Maskless Fine-Pitch Bumping Process

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2015 .

Measurement-based Signal Quality Test of High-speed TSV Channel

Kwang-Seong Choi, Jonghoon J. Kim, Daniel H. Jung, 2012 .

New Impedance Matching Scheme for 60 GHz Band Electro-Absorption Modulator Modules

Kwang-Seong Choi, Yong-Duck Chung, Dong-Suk Jun, 2006 .

Small area high inductance LTCC spiral inductor with high Q factor

Kwang-Seong Choi, Hyo-Hoon Park, Ikechi Augustine Ukaegbu, 2010 .

Circuit modeling technique of electronic package considering S-parameters measurement environments

Kwang-Seong Choi, Yong-Ju Kim, Young-Suk Suh, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

Integration and Characteristics of 40-Gb/s Electroabsorption Modulator Integrated Laser Module With a Driver Amplifier and Bias Tees

Kwang-Seong Choi, Ho-Gyeong Yun, Jong-Tae Moon, 2008, IEEE Transactions on Advanced Packaging.

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation

Kwang-Seong Choi, Joungho Kim, Jonghoon J. Kim, 2015, 2015 International 3D Systems Integration Conference (3DIC).

An efficient and frequency-offset-tolerant channel estimation and synchronization method for PDM CO-OFDM transmission

S. Chandrasekhar, Kwang-Seong Choi, Xiang Liu, 2010, 36th European Conference and Exhibition on Optical Communication.

Novel Bumping Process for Solder on Pad Technology

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2013 .

Analog RF-optic performance of 60 GHz electroabsorption duplexer module

Kwang-Seong Choi, Yong-Duck Chung, Juwan Kim, 2006, SPIE/OSA/IEEE Asia Communications and Photonics.

Novel Bumping and Underfill Technologies for 3D IC Integration

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2012 .

Optimization of Material and Process for Fine Pitch LVSoP Technology

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2013 .

Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Curing Kinetics and Chemorheological Behavior of No‐flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2016 .

Fine-pitch, low-volume SoP(Solder-on-Pad) process

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

3D SiP module using TSV and novel solder bump maker

Kwang-Seong Choi, Yong-Sung Eom, Jong-Tae Moon, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

Kwang-Seong Choi, Jiho Joo, Yong-Sung Eom, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Maskless screen printing technology for 20μm-pitch, 52InSn solder interconnections in display applications

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Bumping and stacking processes for 3D IC using fluxfree polymer

Kwang-Seong Choi, Yong-Sung Eom, Jong-Tae Moon, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2014 .

Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2017 .

Characterization of transmission lines with through-silicon-vias and bump joints on high-resistivity Si interposers for RF three-dimensional modules

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2016 .

High-performance photoreceivers based on vertical-illumination type Ge-on-Si photodetectors operating up to 43 Gb/s at λ~1550nm.

Kwang-Seong Choi, Jiho Joo, Gyungock Kim, 2013, Optics express.

Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test

Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).