Yu-Teng Hsu

Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package

Yu-Jung Huang, Chien-Hung Liao, Li-Shan Chen, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package

Shen-Li Fu, Hsiang-Chen Hsu, Yu-Teng Hsu, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.