Hung-Chun Ho

Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package

Yu-Jung Huang, Chien-Hung Liao, Li-Shan Chen, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Parametric StudyandOptimal Design inWireBonding Process forMiniStack-Die Package

Yu-Jung Huang, Chien-Hung Liao, Shen-Li Fu, 2006 .