Ming-Cheng Lu

Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package

Yu-Jung Huang, Chien-Hung Liao, Li-Shan Chen, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Design a Hypercube-Tree Structure for Peer-to-Peer Streaming

Ming-Cheng Lu, Yu-Wei Chen, 2012 .

The wire sag problem in wire bonding technology for semiconductor packaging

Huang-Kuang Kung, Ming-Cheng Lu, Hung-Shyong Chen, 2013, Microelectron. Reliab..

Parametric StudyandOptimal Design inWireBonding Process forMiniStack-Die Package

Yu-Jung Huang, Chien-Hung Liao, Shen-Li Fu, 2006 .