B. Michel

发表

B. Wunderle, R. K. B. Schacht, A. Hausdorf, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
R. Schacht, B. Wunderle, B. Michel, 2010, 2010 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Th. Hofmann, B. Michel, A. Podlasly, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
J. Punch, S. Rzepka, B. Michel, 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
E. Noack, B. Michel, B. Seiler, 2008, PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics.
B. Wunderle, A. Hausdorf, B. Michel, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Michel, B. Seiler, J.-P. Sommer, 2009, 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS.
B. Wunderle, B. Michel, J. Keller, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
A. Ostmann, B. Michel, J.P. Sommer, 2006, 2006 1st Electronic Systemintegration Technology Conference.
B. Wunderle, B. Michel, J. Keller, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Michel, D. May, O. Wittler, 2006, 2006 1st Electronic Systemintegration Technology Conference.
B. Wunderle, S. Rzepka, B. Michel, 2011, 18th European Microelectronics & Packaging Conference.
R. Schacht, B. Wunderle, B. Michel, 2009, 2009 15th International Workshop on Thermal Investigations of ICs and Systems.
S. Rzepka, B. Michel, D. L. Shah, 2012, 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG).
Th. Hofmann, B. Michel, A. Podlasly, 2010, 3rd Electronics System Integration Technology Conference ESTC.
S. Rzepka, B. Michel, B. Seiler, 2011, 2011 Semiconductor Conference Dresden.
H. Reichl, B. Michel, A. Schubert, 1997, Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.
H. Reichl, R. Schacht, B. Wunderle, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
C. Cane, B. Michel, N. Sabate, 2007, Journal of Microelectromechanical Systems.
H. Reichl, U. Drechsler, B. Wunderle, 2011, 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
J. Bauer, B. Wunderle, B. Michel, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Herbert Reichl, T. Hauck, B. Michel, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).
J. Bauer, B. Wunderle, B. Michel, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
R. Schacht, B. Wunderle, B. Michel, 2010, 2010 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
R. Schacht, B. Wunderle, B. Michel, 2008, 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.
R. Schacht, B. Wunderle, B. Michel, 2008, 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.
H. Reichl, T. Braun, M. Schneider-Ramelow, 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).
B. Michel, R. Dudek, J. Auersperg, 2010, 2010 12th Electronics Packaging Technology Conference.
B. Michel, A. Schubert, E. Kaulfersch, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).
R. Schacht, B. Wunderle, B. Michel, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
C.P. Wong, H. Reichl, R. Leutenbauer, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
B. Wunderle, B. Michel, J. Keller, 2004, 4th IEEE Conference on Nanotechnology, 2004..
H. Reichl, B. Wunderle, B. Michel, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Michel, R. Dudek, J. Auersperg, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Herbert Reichl, Rao Tummala, Madhavan Swaminathan, 1999 .
B. Wunderle, B. Michel, H. Pape, 2010, 3rd Electronics System Integration Technology Conference ESTC.
B. Michel, R. Dudek, H. Hedler, 2005, 2005 7th Electronic Packaging Technology Conference.
B. Michel, D. Vogel, J. Auersperg, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
H. Reichl, B. Wunderle, B. Michel, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
B. Michel, J. Auersperg, B. Michel, 2007, 2007 8th International Conference on Electronic Packaging Technology.
J. Jelonnek, B. Michel, J.-P. Sommer, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).
S. Rzepka, B. Michel, J. Auersperg, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Rainer Dudek, B. Michel, A. Schubert, 1997 .
H. Reichl, R. Schacht, B. Wunderle, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Wunderle, B. Michel, B. Michel, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
H. Reichl, P. Ramm, B. Wunderle, 2008, 2008 58th Electronic Components and Technology Conference.
R. Kulke, B. Michel, J.-P. Sommer, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
B. Wunderle, S. Rzepka, B. Michel, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
H. Reichl, J. Bauer, B. Wunderle, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
B. Michel, A. Schubert, E. Kieselstein, 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
E. Auerswald, S. Rzepka, B. Michel, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
S. Rzepka, B. Michel, R. Dudek, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel, R. Dudek, M. Roellig, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Michel, R. Dudek, W. Faust, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Michel, R. Dudek, W. Faust, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
H. Reichl, T. Braun, B. Wunderle, 2008 .
B. Wunderle, B. Michel, O. Wittler, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel, D. Vogel, 2001, Proceedings of the 2001 1st IEEE Conference on Nanotechnology. IEEE-NANO 2001 (Cat. No.01EX516).
B. Michel, R. Dudek, J. Keller, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
B. Michel, R. Dudek, J. Auersperg, 2007, Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
H. Reichl, U. Drechsler, B. Wunderle, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Michel, R. Dudek, O. Wittler, 2006, 2006 8th Electronics Packaging Technology Conference.
B. Wunderle, B. Michel, B. Michel, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
A. Ostmann, B. Michel, J.-P. Sommer, 2005, 2005 6th International Conference on Electronic Packaging Technology.
H. Reichl, B. Michel, N. Sabate, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
Herbert Reichl, B. Michel, A. Schubert, 1998, Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).
S. Wiese, R. Doring, S. Rzepka, 2006, 2006 1st Electronic Systemintegration Technology Conference.
B. Wunderle, S. Rzepka, B. Michel, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle, B. Michel, E. Kaulfersch, 2008, 2008 2nd Electronics System-Integration Technology Conference.
H. Reichl, R. Schacht, B. Wunderle, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Michel, J. Auersperg, B. Michel, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
H. Reichl, T. Braun, B. Wunderle, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
H. Reichl, B. Michel, O. Wittler, 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
H. Reichl, R. Schacht, B. Wunderle, 2008, 2008 2nd Electronics System-Integration Technology Conference.
H. Reichl, O. Ehrmann, B. Wunderle, 2008, 2008 58th Electronic Components and Technology Conference.
B. Michel, B. Seiler, R. Dudek, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Michel, R. Dudek, B. Michel, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
B. Michel, G. Fischerauer, E. Kieselstein, 1998, IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200).
R. Schacht, B. Wunderle, B. Michel, 2009, 2009 15th International Workshop on Thermal Investigations of ICs and Systems.