M. Clode
发表
Michael Clode,
Samjid H. Mannan,
S. Mannan,
2004
.
Mark Miodownik,
Elizabeth A. Holm,
Michael Clode,
2006
.
T. Sheppard,
M. Clode,
1990
.
M. Zhou,
M. Clode,
M. Zhou,
1997
.
M. Zhou,
M Zhou,
M. Clode,
1998
.
Michael Clode,
Hiren Kotadia,
Samjid H. Mannan,
2010
.
H. M. Lobato,
S. Mannan,
M. Clode,
2009
.
C. Liu,
P. Conway,
D. Hutt,
2008,
IEEE Transactions on Components and Packaging Technologies.
David A. Hutt,
David C. Whalley,
Michael Clode,
2006
.
Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications
H. M. Lobato,
D. Whalley,
C. Liu,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
S. Mannan,
S.H. Mannan,
M. Clode,
2004,
IEEE Transactions on Advanced Packaging.
M. Zhou,
M. Clode,
M. Zhou,
1997
.
S. Mannan,
M. Clode,
2004
.
H. Kotadia,
S. Mannan,
H. Steen,
2012
.
S. Mannan,
Jianfeng Li,
M. Clode,
2006
.
S. Mannan,
Jianfeng Li,
M. Clode,
2006
.
Michael Clode,
Hiren Kotadia,
Samjid H. Mannan,
2012
.
S. Mannan,
A. Crossley,
Jianfeng Li,
2007
.
David A. Hutt,
David C. Whalley,
Michael Clode,
2007
.
F. Khomamizadeh,
A. Kokabi,
A. Roshanghias,
2012
.
Ali Roshanghias,
Michael Clode,
Hiren Kotadia,
2012,
Journal of Electronic Materials.
S. Sajjadi,
S. Mannan,
R. Ashayer,
2007,
2007 9th Electronics Packaging Technology Conference.
H. Y. Ahmad,
M. Clode,
M. Zhou,
1998
.
M. Clode,
M. Zhou,
1997
.
M. Clode,
M. Zhou,
1998
.
M. Clode,
M. Zhou,
1996
.
M. Clode,
M. Zhou,
1998
.