H. Xie

发表

Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9Ag-0.7Cu Pb-free solder alloys

N. Chawla, H. Xie, L. Jiang, 2013, Journal of Materials Science: Materials in Electronics.

Enhancing the Ductility of Sn-Ag-Cu Lead-Free Solder Joints by Addition of Compliant Intermetallics

N. Chawla, H. Xie, N. Chawla, 2013, Journal of Electronic Materials.

On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

Jason J. Williams, N. Chawla, H. Xie, 2012 .

Mechanical properties of intermetallic inclusions in Al 7075 alloys by micropillar compression

N. Chawla, E. Guo, H. Xie, 2015 .

Mechanical characterization of microconstituents in a cast duplex stainless steel by micropillar compression

N. Chawla, E. Guo, T. Jing, 2014 .

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

N. Chawla, D. Friedman, H. Xie, 2013, Journal of Electronic Materials.

Hot Deformation and Constitutive Modeling of TC21 Titanium Alloy

H. Xie, Shengxian Yi, Zhongjiong Yang, 2022, Materials.

Properties of Cerium Containing Lead Free Solder

H. Xie, 2012 .

Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys

Y.-L. Shen, N. Chawla, H. X. Xie, 2011, Microelectron. Reliab..

Microstructure and its effect on magnetic and magnetocaloric properties of the Co50Gd50-xFex glassy ribbons

L. Xia, H. Xie, D. Li, 2020 .

Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints

H. X. Xie, Nikhilesh Chawla, N. Chawla, 2013, Microelectron. Reliab..

Tensile Behavior of Single-Crystal Tin Whiskers

J. Rajagopalan, S. S. Singh, H. Xie, 2014, Journal of Electronic Materials.