Harry Schoeller

发表

Effect of alloying elements on the creep behavior of high Pb-based solders

A. Knobloch, D. Shaddock, Junghyun Cho, 2011 .

Microstructure Evolution and the Constitutive Relations of High-Temperature Solders

A. Knobloch, D. Shaddock, Junghyun Cho, 2009 .

Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb

David Shaddock, Aaron Jay Knobloch, Shubhra Bansal, 2008 .

Superplasticity from viscous flow in high Pb ternary alloy

Junghyun Cho, Harry Schoeller, 2016 .

Exploring Bismuth as a New Pb-Free Alternative for High Temperature Electronics

D. Shaddock, Junghyun Cho, L. Yin, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Developments of high-Bi alloys as a high temperature Pb-free solder

D. Shaddock, Junghyun Cho, L. Yin, 2015, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Effect of Sn Component Surface Finish on 92.5Pb-5Sn-2.5Ag

M. Anselm, I. Khan, E. Cotts, 2014 .

Oxidation and reduction behavior of pure indium

Junghyun Cho, Harry Schoeller, 2009 .

Effect of Oxidation on Indium Solderability

Seungbae Park, Jongman Kim, Harry Schoeller, 2008 .

Thermodynamics and kinetics of oxidation and temperature dependent mechanical characterization of pure indium solder

Harry Schoeller, 2007 .

EFFECT OF TIM COMPRESSION LOADS ON BGA RELIABILITY

Harry Schoeller, N. Graziano, L. Bruno, 2018 .

Thermodynamics and Kinetics of Oxidation of Pure Indium Solders

Seungbae Park, Junghyun Cho, Jongman Kim, 2006 .

Correlation Between the Growth of Voids and Ni3Sn4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C

E. Cotts, Harry Schoeller, F. Hadian, 2019, Journal of Electronic Materials.