M. Hain
发表
L. Müller,
R. Ambat,
H. Conseil-Gudla,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Reinmuth,
M. Hain,
Y. Bergmann,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).