Guangyu Fan

Pressureless Sintering Process of Ag Sinter Paste Bonding Ag Si Die on Bare Cu DBC Using Convection Reflow Oven in Nitrogen for Die Attach

N. Lee, C. Labarbera, Guangyu Fan, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Shear Strength and Thermomechanical Reliability of Sintered Ag Joints Containing low CTE Non-metal Additives for Die Attach

N. Lee, C. Labarbera, C. Clark, 2018, International Symposium on Microelectronics.

PRESSURELESS SINTERING OF NANO- AG PASTE WITH LOW POROSITY FOR DIE ATTACH

N. Lee, C. Labarbera, Sihai Chen, 2014 .

Achieving high reliability via pressureless sintering of nano-Ag paste for die-attach

N. Lee, C. Labarbera, Sihai Chen, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).