S. Chopin
发表
A. Mavinkurve,
J. Zaal,
Yukai Liang,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Yuan Yuan,
Min Ding,
Sheila Chopin,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Peng Su,
Min Ding,
P. Ho,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Peng Su,
Min Ding,
P. Su,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Xingshou Pang,
S. Chopin,
Nathan Xu,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
I. Ahmad,
Min Ding,
A. Jalar,
2007,
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.
P. Su,
I. Ahmad,
P. Eu,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Peng Su,
J. Howell,
P. Su,
2006,
IEEE Transactions on Electronics Packaging Manufacturing.
V. Mathew,
E. Wikramanayake,
S. Chopin,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Peng Su,
Min Ding,
P. Ho,
2006,
IEEE Transactions on Electronics Packaging Manufacturing.
Peng Su,
Min Ding,
P. Su,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
S. Chopin,
M. Dittes,
S. Chopin,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..