文
论文分享
演练场
杂货铺
论文推荐
字
编辑器下载
登录
注册
D. Kuo
发表
A study on the characteristic of UV curved die-attach films in stack CSP (Chip Scale Package)
S. L. Fu, C. L. Chung, T. Lin, 2003, Proceedings of the 12th IEEE International Conference on Fuzzy Systems (Cat. No.03CH37442).