Liang-Cheng Tu

Low temperature fabrication and doping concentration analysis of Au/Sb ohmic contacts to n-type Si

C. Wang, Jinquan Liu, W. J. Wu, 2015 .

Electroplating of 3D Sn-rich solder for MEMS packaging applications

Huafeng Liu, W. J. Wu, J. Fan, 2019, Journal of Micromechanics and Microengineering.

A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

Huafeng Liu, Chenyuan Hu, Kang Rao, 2019, Micromachines.

Polyimide-Damage-Free, CMOS-Compatible Removal of Polymer Residues from Deep Reactive Ion Etching Passivation

Jinquan Liu, W. J. Wu, W. Wu, 2015, Journal of Electronic Materials.

A nano-g micromachined seismic sensor for levelling-free measurements

Huafeng Liu, Wenjie Wu, Jinquan Liu, 2018, Sensors and Actuators A: Physical.

Low Temperature Photosensitive Polyimide Based Insulating Layer Formation for Microelectromechanical Systems Applications

W. J. Wu, W. Wu, Tingting Zhu, 2015, Journal of Electronic Materials.