K. Nagarkar

Voids in thermal interface material layers and their effect on thermal performance

K. Srihari, A. Gowda, S. Tonapi, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Reliability testing of silicone-based thermal greases [IC cooling applications]

K. Srihari, A. Gowda, S. Tonapi, 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..