H. Knoll

Drop Simulation and Stress Analysis of MEMS Devices

T. Hauck, J. Bagdahn, M. Ebert, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Microstructural and Mechanical Characterization of Ceramic Substrates with Different Metallization for Power Applications

J. Schischka, S. Klengel, G. Lorenz, 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).