Kunwoo Park

发表

Junho Lee, Joungho Kim, Joohee Kim, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Joungho Kim, Junho Lee, Heegon Kim, 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI).

Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Jaemin Kim, Junho Lee, Joungho Kim, 2008, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility.

Junho Lee, Joungho Kim, Jonghoon J. Kim, 2013, 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Junho Lee, Joungho Kim, Sunkyu Kong, 2013, 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo).

Sungho Kang, Kunwoo Park, Wooheon Kang, 2015, IEEE transactions on semiconductor manufacturing.

Junho Lee, Joungho Kim, Jun So Pak, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

Joongsik Kih, Junho Lee, Hyunseok Kim, 2008, 2008 Electrical Design of Advanced Packaging and Systems Symposium.

Junho Lee, Joungho Kim, Heegon Kim, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Junho Lee, Joungho Kim, Jun So Pak, 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.

Meeyoung Cha, Kunwoo Park, Jeongmin Kim, 2020, 2020 IEEE International Conference on Big Data and Smart Computing (BigComp).

Kimyung Kyung, Junho Lee, Hyunseok Kim, 2007, 2007 IEEE Electrical Performance of Electronic Packaging.

Junho Lee, Joungho Kim, Jun So Pak, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Jeonghyeon Cho, Jongjoo Shim, Joungho Kim, 2008, 2008 IEEE-EPEP Electrical Performance of Electronic Packaging.

Junho Lee, Joungho Kim, Sukjin Kim, 2013, 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS).

Junho Lee, Joungho Kim, Heegon Kim, 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Junho Lee, Joungho Kim, Jun So Pak, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Joungho Kim, Jaemin Kim, Junho Lee, 2009, 2009 11th Electronics Packaging Technology Conference.

Junho Lee, Joungho Kim, Heegon Kim, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Sungwook Choi, Jinwoo Lee, Taeyun Kim, 2014, 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC).

Junho Lee, Joungho Kim, Heegon Kim, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Kunwoo Park, Jun Hee Lee, Kunwoo Park, 2020, Inorganic chemistry.

Joungho Kim, Jun So Pak, Jonghyun Cho, 2010, 2010 IEEE CPMT Symposium Japan.

Joungho Kim, Jun So Pak, Jonghyun Cho, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Joungho Kim, Manho Lee, Jun So Pak, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Joungho Kim, Manho Lee, Jun So Pak, 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.

Joungho Kim, Eakhwan Song, Jeonghyeon Cho, 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.

Joungho Kim, Jun So Pak, Taigon Song, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

Joungho Kim, Jun So Pak, Jonghyun Cho, 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.

Joungho Kim, Jun So Pak, Eakhwan Song, 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.

Joungho Kim, Jun So Pak, Jonghyun Cho, 2010, 2010 IEEE CPMT Symposium Japan.

Joungho Kim, Jun So Pak, Jonghyun Cho, 2010, 2010 IEEE Electrical Design of Advanced Package & Systems Symposium.

Joungho Kim, Jun So Pak, Jonghyun Cho, 2010, 2010 IEEE CPMT Symposium Japan.

Joungho Kim, Heegon Kim, Jun So Pak, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.