J. J. Clement

Electromigration modeling for integrated circuit interconnect reliability analysis

J. J. Clement, J. Clement, 2001 .

Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects

J. J. Clement, Carl V. Thompson, B. D. Knowlton, 1997 .

Numerical investigations of the electromigration boundary value problem

J. J. Clement, J. R. Lloyd, J. Lloyd, 1992 .

Electromigration in copper conductors

J. J. Clement, James R. Lloyd, J. Lloyd, 1995 .

Modeling electromigration‐induced stress evolution in confined metal lines

J. J. Clement, Carl V. Thompson, C. Thompson, 1995 .

Failure in Tungsten-Filled Via Structures

J. J. Clement, Carl V. Thompson, James R. Lloyd, 1995 .

Modeling Electromigration-Induced Stress Buildup Due to Nonuniform Temperature

J. J. Clement, Carl V. Thompson, C. Thompson, 1994 .

Length Effects on the Reliability of Dual-Damascene Cu Interconnects

Chee Lip Gan, Stefan P. Hau-Riege, Kin Leong Pey, 2002 .

Two electromigration failure modes in polycrystalline aluminum interconnects

J. J. Clement, E. M. Atakov, J. Clement, 1994, Proceedings of 1994 IEEE International Reliability Physics Symposium.

Vacancy supersaturation model for electromigration failure under dc and pulsed dc stress

J. J. Clement, J. Clement, 1992 .