J. Yu

CMP Compatibility of Partially Cured Benzocyclobutene (BCB) for a Via-First 3D IC Process

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2005 .

Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform

J.-Q. Lu, S. Pozder, J. Lu, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

Evaluation of Thin Dielectric-Glue Wafer-Bonding for Three Dimensional Integrated Circuit-Applications

J. McMahon, T. Cale, R. Gutmann, 2004 .

Low-Temperature Titanium-Based Wafer Bonding Ti ∕ Si , Ti ∕ SiO 2 , and Ti ∕ Ti

Jian-Qiang Lu, Ronald J. Gutmann, R. Gutmann, 2007 .

Unit processes for Cu/BCB redistribution layer bonding for 3D ICs

J. McMahon, R. Gutmann, Jian-Qiang Lu, 2006 .

Low-temperature silicon wafer bonding based on Ti∕Si solid-state amorphization

Jian-Qiang Lu, Ronald J. Gutmann, R. Gutmann, 2006 .

Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2006 .

Mechanisms of Low-Temperature Ti/Si-Based Wafer Bonding

R. Gutmann, Jian-Qiang Lu, A. Haberl, 2005 .

Wafer-Level 3D Integration Technology Platforms for ICs and MEMS

Jian-Qiang Lu, J. J. McMahon, Ronald J. Gutmann, 2005 .